Kingston Technology HX318LS11IBK2/8 Datasheet download pdf

DESCRIPTION

HyperX HX318LS11IBK2/8 is a kit of two 512M x 64-bit (4GB)

DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 1Rx8, low

voltage, memory modules, based on eight 512M x 8-bit DDR3

FBGA components per module. Total kit capacity is 8GB. Each

module kit has been tested to run at DDR3L-1866 at a low

latency timing of 11-11-11 at 1.35V or 1.5V. Additional timing

parameters are shown in the PnP Timing Parameters section

below. The JEDEC standard electrical and mechanical specifi-

cations are as follows:

Document No. 4807288-001.A00 03/19/15 Page 1

SPECIFICATIONS

selcyc 11)DDI(LC

Row Cycle Time (tRCmin) 44.7ns (min.)

Refresh to Active/Refresh 260ns (min.)

Command Time (tRFCmin)

Row Active Time (tRASmin) 34ns (min.)

Maximum Operating Power TBD W* @1.35V

0 - V 49gnitaR LU

Operating Temperature 0

C to 85

Storage Temperature -55

C to +100

*Power will vary depending on the SDRAM used.

HX318LS11IBK2/8

8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3L-1866

CL11 204-Pin SODIMM Kit

Continued >>

kingston.com/hyperx

PnP JEDEC TIMING PARAMETERS:

• DDR3-1866 CL11-11-11 @1.35V or 1.5V

• DDR3-1600 CL10-10-10 @1.35V or 1.5V

• DDR3-1333 CL8-8-8 @1.35V or 1.5V

Note: The PnP feature offers a range of speed and timing options to support

the widest variety of processors and chipsets. Your maximum speed will

be determined by your BIOS.

FEATURES

• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~

1.575V) Power Supply

• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)

• 933MHz fCK for 1866Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or

MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE

< 95°C

• Asynchronous Reset

• PCB : Height 1.180” (30.00mm), double sided component

1 2

HX318LS11IBK2/8 1
MODULE DIMENSIONS 2

Summary of Contents

Page 1 - HX318LS11IBK2/8

DESCRIPTIONHyperX HX318LS11IBK2/8 is a kit of two 512M x 64-bit (4GB)DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 1Rx8, lowvoltage, memory modules, based

Page 2 - MODULE DIMENSIONS

Document No. 4807288-001.A00 Page 2continued HyperXMODULE DIMENSIONSAll Kingston products are tested to meet our published specifications. Some

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Kingston Technology HX318LS11IBK2/8 Datasheet

Browse online or download Datasheet for Memory modules Kingston Technology HX318LS11IBK2/8. Kingston Technology HyperX 8GB DDR3L-1866 User Manual

Summary of Contents

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